Component Sense Blog

In an effort to enrich a circular economy in the electronics industry, the EU has introduced the Digital Product Passport (DPP), which will become mandatory for electronics manufacturers from 2027 onwards. Manufacturers must provide detailed product data including material composition, carbon footprint, and circularity metrics through machine-readable formats like QR codes or near-field communication (NFC) tags.

 The global semiconductor industry enters 2026 at a decisive inflection point. 

The C5750X7T2W105M250KE from TDK is a multilayer ceramic chip capacitor (MLCC) designed for high-voltage applications that require stable capacitance and compact packaging.

In the electronics and supply chain industry, Artificial Intelligence is the loudest topic in the room.

The SARA-R510M8S-00B from U-blox AG is an ultra-compact, highly secure LTE-M / NB-IoT cellular module with embedded GNSS and support for U-blox’s IoT Security-as-a-Service. Based on 3GPP Release 13, it is ideal for industrial IoT applications that require long battery life, robust security, and reliable connectivity even in challenging environments. 

Packaged in a tiny 96-pad LGA (16 × 26 mm) footprint and compliant with global bands, the SARA-R510M8S is designed for low-power, wide-area (LPWA) deployments including smart metering, asset tracking, healthcare, and predictive maintenance.