Component Sense Blog

The TLE9471ESV33XUMA1 is a Lite CAN System Basis Chip (SBC) from Infineon Technologies, designed to serve as both a power supply and a CAN bus interface for automotive microcontrollers.

It's well-suited for engineers designing body control, powertrain, or comfort electronics who need a single device to handle voltage regulation, CAN FD communication, and system monitoring without adding extra parts to the board.

The S10124PRIB is a 10G Ethernet/OTN framer, mapper, and PHY device from MACOM Technology Solutions, built to carry 10 Gigabit Ethernet, SONET/SDH, Fibre Channel, and OTN traffic across optical transport networks. It suits engineers and procurement teams building DWDM systems, metro-Ethernet equipment, and multi-service transport platforms who need one device to handle framing, mapping, and physical-layer duties.

The SMTG004XS01 from Thales is an eSIM module built for secure, remotely provisioned cellular connectivity in embedded and IoT devices. Design teams working on connected products that need over-the-air SIM management will find it a solid fit, removing the need for physical SIM swaps across international deployments.

The SDR250AS24-F is a 250W AC/DC enclosed power supply from XP Power, delivering a fixed 24V output built for industrial and IT equipment applications.

It's a solid fit for engineers designing 1U rack-mount systems who need a compact, auto-ranging supply that runs on both 110V and 230V mains without any manual switching.

In January, our Semiconductor Industry Trends Report 2026 set out five themes we expected to shape the industry this year: AI as the primary growth driver, advanced packaging as an emerging constraint, uneven mature-node supply, inventory as a strategic priority, and sustainability and regional manufacturing shaping investment decisions.