Component Sense Blog

For electronics manufacturers, managing inventory is more than a numbers game. Every day, OEMs and EMS companies navigate volatile component pricing, global supply chain disruptions, and the constant threat of excess or obsolete stock. Choosing the right inventory method directly impacts cash flow, operational efficiency, and the ability to monetise surplus components.

Most electronics companies worldwide rely on the FIFO (First In, First Out) method because it aligns with the rapid obsolescence of components and high turnover rates. LIFO (Last In, First Out) is rarely used, but it still appears in niche contexts, particularly in US GAAP-compliant subsidiaries managing stable, long-life components. Understanding both methods helps you make informed decisions that improve financial reporting, reduce waste, and streamline operations — especially when paired with innovative stock solutions like Component Sense's InPlant™.

 

The BUK9207-30B,118 from NXP Semiconductors is a high-efficiency logic-level N-channel TrenchMOS FET, designed for automotive and industrial power switching. Built to the AEC-Q101 automotive qualification standard, it delivers excellent thermal performance, low losses, and high current handling in a compact DPAK (SOT-428) package.  

The STA8090WG from STMicroelectronics is a compact, all-in-one GNSS receiver. It provides accurate navigation and positioning using signals from GPS, Galileo, GLONASS, BeiDou, and QZSS satellites. 

About 10% of a global manufacturing company’s revenue is tied up in excess and obsolete (E&O) components. Many default to scrapping or landfill for disposal. This ultimately hurts profit margins, increases warehouse costs, and undermines sustainability goals. Component Sense helped Corning Inc. address this challenge head-on.  

The BCM6803KFSBG from Broadcom (formerly Avago Technologies) is a high-performance RF System-on-Chip (SoC) designed for industrial and IoT applications that demand seamless wireless and Ethernet integration.