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The TS3A226AEYFFR from Texas Instruments is a compact, autonomous audio jack switch that detects and routes 3- and 4-pole 3.5 mm headset accessories. It features low on-resistance ground FETs, FM antenna support, and built-in EMI suppression, all packed into an ultra-small 9-ball DSBGA (1.2 mm × 1.2 mm) package.
The EFR32MG13P632F512GM32-DR from Silicon Labs is a high-performance 2.4 GHz wireless System-on-Chip (SoC) that combines a +10 dBm radio transceiver with an energy-efficient ARM Cortex-M4 microcontroller. It supports a range of wireless protocols, including Zigbee®, Thread®, Bluetooth Low Energy (BLE), and proprietary 802.15.4, making it a flexible and low-power choice for many IoT applications.
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The SX-SDPAC-2830 is a space-saving wireless module from Silex Technology, offering dual-band Wi-Fi and Bluetooth 4.1 connectivity in a single package, and powered by the Qualcomm Atheros QCA9377 chipset. It delivers robust wireless performance in a space-saving 6.9 mm x 6.9 mm form factor, perfect for embedded, industrial, and IoT devices.
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Along the banks of the sacred river Ganges, a thousand discarded refrigerators, washing machines, televisions, and phones are carried downstream. Waters revered for purity and renewal now carry the weight of charred circuit boards, tangled wires, and shattered motherboards. It is a stark portrait of India’s reality as the world’s third-largest producer of electronic waste, generating more than 3.4 million tonnes each year.
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The SX-SDPAC-2830 is a space-saving wireless module from Silex Technology, offering dual-band Wi-Fi and Bluetooth 4.1 connectivity in a single package, and powered by the Qualcomm Atheros QCA9377 chipset. It delivers robust wireless performance in a space-saving 6.9 mm x 6.9 mm form factor, perfect for embedded, industrial, and IoT devices.
