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The SX-SDPAC-2830 is a space-saving wireless module from Silex Technology, offering dual-band Wi-Fi and Bluetooth 4.1 connectivity in a single package, and powered by the Qualcomm Atheros QCA9377 chipset. It delivers robust wireless performance in a space-saving 6.9 mm x 6.9 mm form factor, perfect for embedded, industrial, and IoT devices.
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Along the banks of the sacred river Ganges, a thousand discarded refrigerators, washing machines, televisions, and phones are carried downstream. Waters revered for purity and renewal now carry the weight of charred circuit boards, tangled wires, and shattered motherboards. It is a stark portrait of India’s reality as the world’s third-largest producer of electronic waste, generating more than 3.4 million tonnes each year.
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The SX-SDPAC-2830 is a space-saving wireless module from Silex Technology, offering dual-band Wi-Fi and Bluetooth 4.1 connectivity in a single package, and powered by the Qualcomm Atheros QCA9377 chipset. It delivers robust wireless performance in a space-saving 6.9 mm x 6.9 mm form factor, perfect for embedded, industrial, and IoT devices.
The TPSM63606RDLR from Texas Instruments is a high-efficiency DC/DC step-down power module that delivers up to 6 A of continuous output current. With an adjustable output voltage, integrated inductor, and a compact, thermally enhanced QFN (9 x 7 x 4 mm) package, it simplifies power design in space-constrained systems.
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The B32776S8705K (also known as B32776T8685K) from EPCOS / TDK is a high-performance 7 µF, ±10%, 800 V metallized polypropylene film (MKP) capacitor. Built for DC link applications in fast-switching power modules, it offers excellent self-healing characteristics, low ESR, and high ripple current capability.
