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The TPSM63606RDLR from Texas Instruments is a high-efficiency DC/DC step-down power module that delivers up to 6 A of continuous output current. With an adjustable output voltage, integrated inductor, and a compact, thermally enhanced QFN (9 x 7 x 4 mm) package, it simplifies power design in space-constrained systems.
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The B32776S8705K (also known as B32776T8685K) from EPCOS / TDK is a high-performance 7 µF, ±10%, 800 V metallized polypropylene film (MKP) capacitor. Built for DC link applications in fast-switching power modules, it offers excellent self-healing characteristics, low ESR, and high ripple current capability.
The C3216X7R1V106MT0Y0E from TDK is a Multilayer Ceramic Capacitor (MLCC), 1206 package, 10 µF, 35 V, X7R, ±20% tolerance. Designed for reliable performance across a wide temperature range, this capacitor is ideal for power supply decoupling, smoothing, filtering, and general-purpose applications in consumer electronics, industrial systems, and automotive designs.
The TS128MLQ64V6J from Transcend is a 1GB DDR2-667 Long-DIMM designed for reliable performance in desktops, industrial PCs, and embedded systems. Built to JEDEC standards using high-grade DRAM chips from first-tier suppliers, this module is 100% tested to ensure stability, compatibility, and long-term reliability.
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The EN15000G / EPIA-EN15000G from VIA Technologies is a high-performance Mini-ITX mainboard designed for embedded, industrial, and multimedia applications that demand reliability, compact design, and efficient performance. Built around the 1.5 GHz VIA C7™ NanoBGA2 processor and VIA CN700 chipset with integrated MPEG-2 acceleration and VIA C-Pro 2D/3D graphics, it ensures smooth media playback, robust connectivity, and low power consumption.
