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The KX128-1091, developed by Rohm Semiconductor under the Kionix brand, is a versatile tri-axis digital accelerometer designed for a wide array of motion-sensing applications in embedded systems.
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The SX-SDPAC-2830 is a space-saving wireless module from Silex Technology, offering dual-band Wi-Fi and Bluetooth 4.1 connectivity in a single package, and powered by the Qualcomm Atheros QCA9377 chipset. It delivers robust wireless performance in a space-saving 6.9 mm x 6.9 mm form factor, perfect for embedded, industrial, and IoT devices.
The TPSM63606RDLR from Texas Instruments is a high-efficiency DC/DC step-down power module that delivers up to 6 A of continuous output current. With an adjustable output voltage, integrated inductor, and a compact, thermally enhanced QFN (9 x 7 x 4 mm) package, it simplifies power design in space-constrained systems.
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The B32776S8705K (also known as B32776T8685K) from EPCOS / TDK is a high-performance 7 µF, ±10%, 800 V metallized polypropylene film (MKP) capacitor. Built for DC link applications in fast-switching power modules, it offers excellent self-healing characteristics, low ESR, and high ripple current capability.
The C3216X7R1V106MT0Y0E from TDK is a Multilayer Ceramic Capacitor (MLCC), 1206 package, 10 µF, 35 V, X7R, ±20% tolerance. Designed for reliable performance across a wide temperature range, this capacitor is ideal for power supply decoupling, smoothing, filtering, and general-purpose applications in consumer electronics, industrial systems, and automotive designs.
