The SX-SDPAC-2830 from Silex is a dual-band 802.11a/b/g/n/ac plus Bluetooth 5.0 System-in-Package (SiP) module designed to deliver high-performance wireless connectivity in compact embedded designs.
Built around the Qualcomm Atheros QCA9377 chipset, this 1x1 802.11ac Wave 2 module integrates RF front-end components and power management into a compact 6.9 mm × 6.9 mm footprint. The SiP architecture reduces external components, lowers BOM complexity, and simplifies PCB layout for space-constrained applications.
With a current manufacturer lead time of 34 weeks, available UK stock provides an immediate supply advantage for production builds.
Let’s take a closer look at what makes this module a practical choice for embedded wireless applications.
Key Features of the SX-SDPAC-2830
Dual-Band 802.11a/b/g/n/ac (1x1)
Supports both 2.4 GHz and 5 GHz operation with 802.11ac Wave 2 capability, enabling strong throughput and reliable connectivity.
Integrated Bluetooth 5.0 + HS
Provides Bluetooth Smart Ready support with backward compatibility, enabling combined Wi-Fi and Bluetooth functionality from a single module.
SDIO 3.0 + High-Speed UART Interfaces
SDIO 3.0 interface for WLAN and high-speed UART for Bluetooth integration, supporting a wide range of embedded host platforms.
Compact System-in-Package Design
Measuring just 6.9 mm × 6.9 mm, the SiP format minimizes board space and eliminates the need for external flash through integrated OTP memory.
Single 3.3 V Supply
Operates from a 3.30 VDC supply (±5%) with integrated power management for simplified power design.
Industrial Operating Temperature Range
Rated from –20°C to +80°C (case temperature), supporting industrial and embedded deployment environments.
Applications of the SX-SDPAC-2830
The SX-SDPAC-2830 is commonly used in:
- Industrial embedded systems
- IoT gateways and edge devices
- Smart appliances
- Medical and diagnostic equipment
- Connected HMI and control systems
- Wireless-enabled industrial electronics