The STA8090FGBDTR from STMicroelectronics is a single-die GNSS positioning receiver from the Teseo III family, combining an embedded RF front-end, an ARM9 core, and in-package Flash to receive signals from GPS, Galileo, GLONASS, BeiDou, and QZSS. Its minimal external bill of materials and small footprint make it a strong fit for engineers building trackers, telematics units, and other compact location-aware devices where board space and cost both matter.
As part of ST’s Teseo III range, the STA8090FGBDTR pairs 256 kByte of internal RAM with up to 32 Mbit of in-package Flash, so the device runs a complete GNSS firmware stack without external memory. The "BD" variant also supports TESEO-DRAW, ST’s dead reckoning firmware, which maintains positioning through tunnels and urban canyons where satellite signals drop out. It ships in a surface-mount 99-ball TFBGA package measuring just 5 x 6 x 1.2 mm, and the details below cover what that means in practice.
Multi-constellation satellite reception
The receiver tracks GPS, Galileo, GLONASS, BeiDou, and QZSS signals, giving designs access to more satellites for faster fixes and more reliable positioning in difficult environments.
Embedded RF and ARM9 processing on a single die
With the RF front-end and an ARM9 core integrated into one chip, the STA8090FGBDTR handles acquisition, tracking, and navigation on its own, and communicates with a host over standard UART, SPI, and I²C interfaces. Its wide I/O availability also lets it act as the main microcontroller in simpler designs.
On-chip memory for a self-contained design
256 kByte of internal RAM and up to 32 Mbit of in-package Flash allow the device to store and run its full GNSS firmware without external memory, reducing component count and simplifying the board layout.
Dead reckoning support via TESEO-DRAW
As a "BD" variant, this part runs ST’s TESEO-DRAW dead reckoning firmware, sustaining a position estimate when the satellite signal is temporarily lost. That matters for automotive and asset-tracking applications that pass through tunnels or dense city streets.
Compact 99-ball TFBGA package
The surface-mount TFBGA99 package measures 5 x 6 x 1.2 mm with a 0.5 mm pitch, suiting space-constrained boards in portable and wearable products. It is supplied on tape and reel (the "TR" suffix) for automated pick-and-place assembly.
Industrial temperature range and RoHS compliance
Rated for operation from -40°C to +85°C, the device is built for demanding industrial and automotive conditions. It is RoHS compliant (ST Ecopack2), supporting green and compliant manufacturing.
This part is typically used in: