The SX-SDPAC-2830 is a space-saving wireless module from Silex Technology, offering dual-band Wi-Fi and Bluetooth 4.1 connectivity in a single package, and powered by the Qualcomm Atheros QCA9377 chipset. It delivers robust wireless performance in a space-saving 6.9 mm x 6.9 mm form factor, perfect for embedded, industrial, and IoT devices.
Designed to simplify wireless connectivity for embedded and industrial devices, the SX-SDPAC-2830 supports MU-MIMO, antenna diversity, and low host CPU utilization, making it ideal for high-efficiency, cost-sensitive designs.
Let’s take a closer look at what makes this SiP module a go-to solution for embedded wireless design.
10 µF Capacitance, 35 V Rating
Delivers stable performance for decoupling and filtering in medium-voltage circuits.
X7R Temperature Characteristic
Ensures capacitance stability within ±15% from -55°C to +125°C.
Compact 1206 (3216 Metric) Package
Offers a space-efficient design suitable for high-density PCBs.
±20% Tolerance
Balances precision with versatility across a wide range of designs.
RoHS and Pb-Free Compliant
Environmentally safe and compliant with global manufacturing standards.
Durable MLCC Construction
Stacked ceramic layers deliver reliability and long service life.
Standard Reel Packaging
Supplied in 2000-piece reels for efficient high-volume assembly.
Applications of the C3216X7R1V106MT0Y0E
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