The SX-SDPAC-2830 is a space-saving wireless module from Silex Technology, offering dual-band Wi-Fi and Bluetooth 4.1 connectivity in a single package, and powered by the Qualcomm Atheros QCA9377 chipset. It delivers robust wireless performance in a space-saving 6.9 mm x 6.9 mm form factor, perfect for embedded, industrial, and IoT devices.
Designed to simplify wireless connectivity for embedded and industrial devices, the SX-SDPAC-2830 supports MU-MIMO, antenna diversity, and low host CPU utilization, making it ideal for high-efficiency, cost-sensitive designs.
Let’s take a closer look at what makes this SiP module a go-to solution for embedded wireless design.
Dual-Band 802.11a/b/g/n/ac + Bluetooth 4.1 + HS
Supports both 2.4 GHz and 5 GHz Wi-Fi plus Bluetooth Smart Ready connectivity.
1x1 MU-MIMO Performance
Enables fast, efficient data throughput with for 802.11ac Wave 2 multi-user MIMO support.
Compact 6.9 x 6.9 mm SiP Package
Minimises footprint and BOM with integrated RF front-end, diplexer, and coupler.
SDIO 3.0 & Hi-Speed UART Interfaces
Offers flexible integration for both WLAN and Bluetooth applications.
On-Chip OTP Memory
Eliminates the need for external flash with 1.5 KB of embedded programmable memory.
Power-Efficient Design
Single 3.3 V supply with optional 1.8 V or 3.3 V I/O support and on-chip PMU.
Antenna Diversity & Offload Capability
Supports signal-based antenna switching and minimal host utilisation at 11ac speeds.
Applications of the SX-SDPAC-2830
The SX-SDPAC-2830 is ideal for embedded designs requiring reliable wireless connectivity in a compact footprint:
Why Choose Component Sense?
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When sourcing the SX-SDPAC-2830, choose Component Sense for authenticity, speed, and sustainability.