---
title: "Now in Stock: XC5VLX50-1FF676C | Xilinx Virtex-5 LX50 FPGA | Brand New, Fully Traceable, and Ready to Ship!"
description: Discover the XC5VLX50-1FF676C FPGA from Xilinx, a reliable choice for high-performance applications. Enjoy fast shipping and fully traceable components with Component Sense.
---

[Component Sense Blog](https://www.componentsense.com/blog)

# [Now in Stock: XC5VLX50-1FF676C | Xilinx Virtex-5 LX50 FPGA | Brand New, Fully Traceable, and Ready to Ship!](https://www.componentsense.com/blog/xc5vlx50-1ff676c)

 Written by [Aaliyah Mclaine](https://www.componentsense.com/blog/author/aaliyah-mclaine) | 12-Oct-2026

The XC5VLX50-1FF676C from Xilinx is a field-programmable gate array (FPGA) designed for high-performance logic, signal processing and embedded control. If you're maintaining or building equipment that needs dense, reprogrammable logic on an established Virtex-5 platform, this part is a dependable choice.

This device is part of the Xilinx Virtex-5 LX family (Xilinx is now part of AMD), built on a 65 nm process with a 1.0 V core. It comes in a 676-ball flip-chip fine-pitch BGA (FF676) with a -1 speed grade and a commercial temperature rating.

## Key Features of the XC5VLX50-1FF676C

**High-density programmable logic**   
The LX50 provides 46,080 logic cells across 7,200 slices, built on Virtex-5's 6-input LUT architecture. That gives you room for complex control, protocol and data-path logic in a single device.

**On-chip memory and DSP resources**   
It includes 1,728 Kb of block RAM and 48 DSP48E slices for multiply-accumulate and filtering functions. This suits designs that need buffering and arithmetic performance without external memory for every task.

**Flexible clock management**   
Six clock management tiles, each combining digital clock managers and a PLL, handle clock synthesis, de-skew and phase control. This simplifies multi-clock designs and timing closure.

**Versatile SelectIO interfaces**   
The FF676 package delivers 440 user I/Os supporting a wide range of single-ended and differential standards, including LVDS, LVCMOS, HSTL and SSTL. It interfaces readily with memory, ADCs, DACs and other logic.

**27 × 27 mm BGA for dense PCB layouts**   
The 676-ball flip-chip BGA on a 1.0 mm pitch balances I/O count with board footprint. It is the exact part for boards designed around the XC5VLX50 in the FF676 package, so you can keep production running without a redesign.

**Tin-lead package for leaded assembly**   
This is the standard FF676 package with tin-lead solder balls; the lead-free equivalent carries the FFG676 designation. It suits leaded assembly lines and applications operating under RoHS exemptions, such as defence, aerospace and certain industrial equipment.

 

## Applications of the XC5VLX50-1FF676C

This part is typically used in:

- Communications equipment control and signal processing
- Test and measurement instruments
- Medical imaging systems
- Industrial control systems
- Video and image processing equipment
- Radar and defence electronics
- Aerospace and avionics systems
- High-speed parallel data acquisition
- Embedded control and bridging logic
- Legacy product maintenance and repair

 

[View full post](https://www.componentsense.com/blog/xc5vlx50-1ff676c)

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