The S10124PRIB is a 10G Ethernet/OTN framer, mapper, and PHY device from MACOM Technology Solutions, built to carry 10 Gigabit Ethernet, SONET/SDH, Fibre Channel, and OTN traffic across optical transport networks. It suits engineers and procurement teams building DWDM systems, metro-Ethernet equipment, and multi-service transport platforms who need one device to handle framing, mapping, and physical-layer duties.
Part of MACOM's Yahara family, the S10124PRIB integrates dual 10G XFI client and line interfaces with G.709 and enhanced FEC in a single 25 x 25 mm plastic ball grid array. The surface-mount, Pb-free package fits standard high-speed line-card assembly.
Here are the key features that matter for your design.
Integrated 10G Framer, Mapper, and PHY
The device combines OTN/SONET framing, mapping, and the physical-layer interface on one chip. That cuts board complexity and component count on 10G line cards.
Dual 10G XFI Client and Line Interfaces
Both client-side and line-side traffic run over integrated 10G XFI interfaces, with an OIF-compliant SFI-4.1 option and flexible SFI-4.2, SFI-5s, or XAUI system interfaces. This makes the part adaptable across a range of optical module and backplane designs.
Integrated G.709 and Enhanced FEC
Built-in ITU-T G.709 GFEC and MACOM's Enhanced FEC (ITU-T G.975.1 I.4) extend reach and improve error performance in low-OSNR metro and long-haul links. You get carrier-grade correction without an external FEC device.
Multi-Protocol, Multi-Rate Support
One part handles 10GBASE-R/10GBASE-W, OC-192/STM-64, 8G and 10G Fibre Channel, and OTU-2 (standard and overclocked) client signals. That flexibility lets a single line-card design serve several network types.
25 x 25 mm Plastic BGA, Surface-Mount
The S10124PRIB ships in a 25 x 25 mm plastic ball grid array suited to standard SMT assembly on dense, high-speed PCBs.
Pb-Free and RoHS-Compliant
The package is lead-free and RoHS-compliant, supporting compliant manufacturing and greener supply chains.
This part is typically used in: